Dispensing System

Micro dispensing system

Committed to providing operation, connection, assembly, testing equipment and automation solutions for leading customers in integrated circuits,  discrete devices, consumer precision electronics, and smart automotive electronics industries

Vertically Integrated Product System

Adopt a vertical integration strategy; the products are independently  developed from core components to complete machines, to the entire line,  and can respond quickly to meet different customer needs

Core modules
Auto-line customization
Whole-set equipment

Integrated Circuit-typical cases

Adopt a vertical integration strategy; the products are independently  developed from core components to complete machines, to the entire line,  and can respond quickly to meet different customer needs

The first domestic (China) dispenser to be used in the mass production of FCBGA underfill(GS600SU)
Auto-line customization
FCBGA CUF processing
FOWLP UF processing

Discrete Components

Application fields

  • Lead frame Package
  • Substrate Package
  • Shell & Case Package

Typical processes

  • Chip Coating
  • Solder paste painting
  • Potting
  • Component reinforced-gluing
  • Underfill