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Equipment

There are five types of products.

  1. Advanced Packaging Measurement equipment—CFM1, CWS1, HDM1, FM1, TM1
  2. Advanced packaging comprehensive measuring equipment – ACM1
  3. White light interferometer series—WLI Series
  4. Thickness measurement module – nXV
  5. Optical Triangulation 3D Module – NL

Advanced Packaging Measurement Equipment

  • CFM1 – CMP Flatness Measurement Equipment

  • CWS1 – Die Warpage Measuring Equipment

  • HDM1 – HCB Dishing Metrology Equipment

  • FM1 – Wafer Warpage Measurement Equipment

  • TM1 – TSV Metrology Equipment

System Overview:
Our advanced measurement system is equipped with high-resolution optics, enabling precise topographic analysis of μ-bumps and microstructures. When wide-area measurements are required, a robust algorithm ensures optimal data accuracy and consistency.

Key Capabilities:

  • μ-Bump Height Measurement

  • High-Resolution HBM Warpage & Stress Analysis

  • Engineered for reliability and precision, supporting advanced packaging inspection needs across diverse applications.

Advanced Packaging Comprehensive Measuring Equipment

  • CM1 – RDL/CD Metrology Equipment

Overview:
As advanced packaging technologies evolve, the demand for high-precision measurement continues to grow. Leveraging proprietary optical expertise and innovative engineering, the ACM1 enables accurate measurement of key parameters critical to advanced packaging processes.

Capabilities:

  • Critical Dimension (CD)

  • Redistribution Layer (RDL) Thickness and Width

  • Total Indicator Reading (TIR)

  • Height

  • Overlay

Compared to conventional measurement systems, ACM1 offers significantly expanded functionality for more comprehensive and detailed process evaluations. Its versatility and precision make it essential for optimizing yield and quality in next-generation packaging lines.

White Light Interferometer Series

  • WLI Series – White Light Interferometer

Overview:
Ultra-Precision Measurement Based on WLI Technology. The WLI-based system delivers ultra-precise metrology with high speed and reliability, suitable for mass production environments.

Applications:

  • Step height, film thickness, and surface roughness at sub-micron levels

  • Semiconductor microstructures

  • Bump profiles

  • Surface defects

  • Particle-induced protrusions

  • Other fine features

Key Features:

  • Fast Measurement: Less than 1 second per scan

  • Versatile Capabilities: Step height, depth, and roughness

  • Ultra-Fine Z-Axis Resolution: Down to several hundred nanometers

  • PSI Mode: Nanometer-level precision

  • Membrane Separation Function: Layered/membrane-based structure analysis

  • Auto Focus: Enhances ease of use and repeatability

  • Proven Reliability: Applied across diverse industries and product lines

This system combines speed, precision, and flexibility to meet next-gen semiconductor and microelectronics demands.

Thickness Measurement Module

  • Product:

    • nXV-1 – Spectral Interference Displacement Laser Sensor

    Overview:
    An advanced thickness measurement system designed for both transparent (films, glass) and opaque/rough materials (silicon, sapphire wafers). It also measures applications that were previously difficult to evaluate, including secondary battery sealing thickness and PCB conformal coating thickness.

Key Features:

  • Multi-Channel Support: Up to 16 probe channels on one controller for simultaneous multi-point measurements.

  • High-Speed Measurement: Optimized for mass production throughput.

  • Nano-Level Repeatability: Exceptional precision and consistency at nanometer scale.

  • Multi-Layer Compatibility: Supports diverse material layers across different production needs.

Optical Triangulation 3D Module

Product:

  • NL-1 – Optical Triangulation Measurement Module

Overview:
High-speed 3D measurement solution at a competitive price, designed for glossy surfaces and varying height levels, ideal for mass production.

Key Features:

  • 3D Measurement on Glossy Surfaces: Accurate surface profiles even on reflective materials.

  • Fast & Precise Height Measurement: Multiple height levels, including wafer protrusion height.

  • Robust & Reliable: High shock resistance for stable performance in demanding environments.

  • Versatile Application: Suited for industrial fields requiring precision surface and structural analysis.

This system combines affordability with advanced functionality — an excellent solution for high-throughput, precision-driven manufacturing environments.

EQUIPMENT LIST

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1.3D wafer Bump & Wire Bonding AOI Inspection System, Wafer Bump 3D Vision Inspection

2. Abatement Systems, Liquid Delivery System

3. Advanced Packaging Measurement equipment, White Light interferometer series, Thickness measurement module, optical triangulation 3D module

4. AI Vision Inspection, Ultrasonic ACF Bonding, Package AI Vision Inspection, Conformal Coating Inspection, LED Vision System, Wafer Vision Inspection, Curved 3D Glass Inspection and measurement, Ultrasonic ACF Bonding

5. AI, AOI, Laser, IR Solution

6. Application: STI, Poly, Contact and Gate Etch, Metal and via/Trench Etch/Cu CMP, Micro ADI/Photo cell monitor, Tool Monitor, Films, and Post-CMP Films/Wafer Inspection System

7. Argon Fluoride Immersion Lithography/ArF: Argon Fluoride Dry Lithography/KrF: Krypton Fluoride Lithography

8. Atomic Layer Deposition, Epitaxy/Silicon Carbide, PECVD, and vertical Furnaces (LPCVD: Low Pressure Chemical Vapor Deposition)

9. ATM System / VTM System / Robots / 300 mm Ion Implanter, Vacuum Robot for High Vacuum Process

  1. Auto Pressure Controller, Vacuum Transfer System, Dispenser, Refurbished equipment

11. Automation, Ozone System, HORIBA Concentration Monitor, AION PVA Brush

12. Automated Test Equipment, Component Test Systems, Metrology/SEM

13. Ball placement system, camera module system, laser application system, process automation system, Package EMI shielding system, Package sorter P&P system

14. Battery and Semiconductor Inspection

15. Burn-In Sorter/Test Handler, Vision Inspection, Gantry Automation

16. Burn-in Tester and Burn-in Board / MFT, MBT, TBT, MLCC, LBT, and Board

17. Camera Module and Test Equipment (Probe Card), Semiconductor Parameter Analyzer

18. CCSS (Central Chemical Supply System) Wet System, Inkjet printing system

19. Chemical Mechanical Polishing, Wet Cleaning System

20. Clean, Etch, Photo, Test and Package/Line Automation, Transportation, Storage

21. Cube Prober (HBM), Memory Test Handler, SoC Test Handler, Module Test Handler, Test and Vision Solution

22. Descum equipment, descum and surface treatment for wafer-level semiconductor packaging process

23. Deposit metal materials (ITO, Al, Mo, Ag, Ti, IGZO with application), Horizontal Pass with vacuum robot, Industrial deposition

24. Deposition Process Equipment, Treatment (Film Property Improvement Process Equipment), Ultrasonic Generators, Measuring Systems

25. Dicing Saw, Saw & Sorter, MLCC Cutter, Breaker, Tape Mounter, Wafer Cleaner, Mask manufacturing equipment

26.Dispenser, Attach, Laser assisted bonder, Micro SBM, Cu pin, Laser compression bonder, Protec laser reflow, Bin sorter

27. Dry Etcher for Mobile Display, EV/Glass Treatment/Organic, Metal Deposition Process/Bio Health, Medical and Cosmetic

28. Dry Strip, Dry Cleaning, NHM Strip, Edge Clean

29. Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder/Machining, Inspection and Laser Total Solution, Surgical Robot, Sensors

30. Etchers and nano implant / ICP Etcher, DRIE Etcher, CCP Etcher, LED Etcher, Nano Imprint

31. Etching, Cleaning, Treatment/Automation + Plasma + Vacuum Process

32. EUV lithography solutions

33. EUV Mask Solution, Laser Cleaner, CO₂ Cleaner

34. Exhaust Management, Thermal management

35. FPD repair equipment / Inspection & Analysis

36. Front-End/PE-CVD, ALD, Back-End/Die Bonder, Flip Chip Bonder, TC Bonder, Hybrid Bonder

37. FSH Microscopy Module, FSH AOI (Advanced Packaging), FSH Interferometry Module, FSH Camera Module, Larger area inspection for wafers

38. Gas Supply System, Chemical Supply System

39. Global Smart Factory & Solution, Semiconductor, Display, Second Battery, MH/OHT, Clean Conveyor system, AGV, OHS, Roll OHT

40. HBM TC Bonder, Vision Placement, Micro Saw, EMI Shield, Metal grinder, Laser Ablation and Laser mark

41. High-pressure hydrogen annealing equipment

42. In-Line System, Process Equipment (3D Lamination, Dispenser, Grinder, Bake Oven, Furnace Oven, Micro LED Dispenser)

43. Inspection & Measuring equipment

44. Inspection Automation Equipment (Cap Exterior Inspection, Contamination Inspection, Liquid Level Inspection, Leak Inspection)

45. Jusung Engineering’s ALD equipment achieves uniform and high-quality thin films at temperatures below 300°C, regardless of complex underlying structures, across processes such as ultra-fine DRAM, 200+ layer 3D NAND, and sub-10 nm logic devices

46. Laser solution

47. Manufacturing Stage/Gantry, Air Bearing, Hybrid

48. Memory Tester, SSD Tester, SoC Tester, Burn-in Tester

49. Micro Power Dry System, Native Oxide Removal System, Diffusion Furnace, Vacuum Melting Furnace, Integrated System, Sputtering System, PE-CVD System, Evaporation System, Aching System, Dry Etching System, Ion Implantation System, Vacuum Furnace, Lyophilized

50. Nano Inspection for inner and outer defects of Si Wafer or Glass Substrate, Overlay, Vacuum Stage

51. N2 Purge System, EFEM Dehumidification

52. OHT System, Wire Bonder (Back End), Die Attach (Back End), FOUB Stocker (Back End), Memory Test Handler, EFEM, SMIF (Mask Loader), Try Stocker

53. POU Abatement System, RTO (Regenerative Thermal Oxidizer), IES (Ion Exchange System)

54. Poly Etcher System (Conductor Etcher System), Metal Etcher System, Oxide Etcher System (Dielectric Etcher System)

55. Probe Card, Interface Board, Test Socket, MEMS Product

56. Probe Card, Probe Station, Battery Recycling

57. Quartz, Tungsten, Molybdenum / tube, Bath, carrier, chamber

58. Refurbishing Equipment / CVD Equipment (P-5000, Centura-5200, Ultima-HDP, Producer, 300 mm Producer-SE/GT, 300 mm Ultima-X), PVD Equipment (Centura PVD, Endura-5500, 300 mm Endura-CL/II), Etch Equipment (Centaur DPS + Metal, Centaur DPS + Poly, Centura Super E/eMax), RTP Equipment (Centura XE+/DPN), EPI Equipment (Centura EPI)

59. Scrubber and Chiller

60. Semiconductor: DI, ABF Via Drilling, TGV (Through Glass Via) / Display: Laser cutters for Display

61. Semiconductor Equipment (VACTRA, ATRA, Vacuum Transfer Solution and ATM Transfer Solution)

62. Semiconductor, Display, EV Battery, and Solar Cell Industry / Semiconductor: Rapid Thermal Process, Sputter System, Descum System, Laser Dicing, Laser Annealing, and Laser Ablation. EV Battery: NG Sorter, Tray Washer, Cell Tapping, and Packing. Solar Cell: LEI, LDSE, LCO

63. Semiconductor Manufacturing Equipment (THC, Dehumidifier, CHR)

64. SIC Epitaxy for power semiconductor, Wide Process Hard Mask

65. Solder Ball Attach, Marking System, Package Laser Saw System, Router System, Flux Pre-Cleaning System, Solder Ball Attach Tool kit

66. Standard WTR, Telescopic WTR, SCARA Robot, Cartesian WTR, LED Wafer Transfer Robot, Glass Wafer Transfer Robot, FOUP Handling Robot, and Vacuum Robot. Modules: FOUP Opener, Cassette Loader and EFFM (Equipment Front End Module)/Dental Machine

67. Strip Marker (2 Beam / 4 Beam marker), Tray Marker, Wafer topside and backside marker, Wafer ID marker, Grooving & Dicing, PKG Cutting, Pop drilling

68. Sputtering System (Loader System, Roll-to-Roll system (Flexible Substrate), Vertical Cluster Sputter, In-Line Horizontal Sputter)

69. Temporary Wafer Bonding System, Wafer De-Bonding System, Collective Die to wafer Bonding system, Vacuum Cluster System, EFEM, Wafer Transfer Robot, Load Port Module, Pre-Aligner

70. The front-end process (Clean, Etch, strip), the back-end process (Flux, Etch, debond), memory and logic devices, rapid heat treatment for silicon wafers

71. Thermal LPCVD, Plasma Treatment, Large Batch Thermal ALD System, Mini Batch and Dry Cleaning

72. Thin Film deposition system

73. Tools of wet processing, Electrochemical Plating, thermal deposition processing, Track Systems, PECVD, Stress-Free Polishing

74. Transfer Module (Aries Series) / PM (GAS, CDA, PCW : Process Cooling Water)

75. Wafer Macro Inspection, Wafer Review Station, Wafer Warpage Inspection, Wafer Edge Macro Inspection, Mount Inspector, Die Attach Inspection, Wire Bonding Inspection, Stocker System (ASRS), Tower Lifter and rail